產品信息
    廣東USP-1515MG,USP-1515M4批發(fā)，晶圓切割，uv
    價格：電詢 元(人民幣) 產地：新友維
    最少起訂量：卷 發(fā)貨地：15377723326
    上架時間：2012/6/21 瀏覽量：790
    東莞市新友維粘膠制品有限公司
    經營模式：生產加工 公司類型：私營有限責任公司
    所屬行業(yè)：膠粘劑 主要客戶：松下電器，藍思科技，

    聯(lián)系方式

    聯(lián)系人：王桂云 (小姐)

    手機：

    電話：

    傳真：

    郵箱：uwtape@uwtape.com

    地址：東莞市長安鎮(zhèn)富寧街9號

    詳情介紹

    晶圓切割膠帶- Pressure Sensitive Series -

    Part Number :
    F - 90
    T - 80
    T - 120
    GE - 200
    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.? Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement.? Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
    We Toyo Adtec consider needs of each user and choose appropriate tapes.
    Feature
    ● Various product line
    ● standard type (AD series)
    ● high-performance to difficult-to-adhere workpiece (ＧＤ series)
    ● excellent stability against elapsed deterioration (Ｔ series)
    ● high-performance to laser-dicing (F-90)
    ● Easy pick-up with excellent expandability

    Specification
    Recommended Works Part Number Base
    Film     		Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
    Si
    GaAs
    Other Semiconductor     		F-90MW PO MW 90 10 1 1 PVC-free type
    T-80MW PVC 80 0.8 0.7 Excellent temporal stability
    T-80HW 1.7 1
    T-120HW 120 1.7 1
    Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece

    ＊The above data is just for representing value, and not guaranteed value.
    ＊Static type is lined up.
    ＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
    ＊Separator thickness is not included.

    晶圓切割膠帶- UV Series -

    Part Number :
    UDV - 80J / UDV - 100J / UHP - 110B
    UHP - 0805MC / UHP - 1005M3
    UHP - 110M3 / UHP - 1025M3
    UHP - 1510M3 / UHP - 1525M3
    USP - 1515M4 / USP - 1515MG
    UDT - 1025MC / UDT - 1325D
    UDT - 1915MC
    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.
    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.? Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.
    Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation.? Elegrip dicing tapes can correspond with anti-static requirement.? Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.
    We Toyo Adtec consider needs of each user and choose appropriate tapes.

    Feature
    ● Excellent control to back-side chipping and chip fly-off.
    ● Excellent adhesiveness.
    ● Smooth peeling by UV.
    ● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

    Recommended
    Work I     		Si
    GaAs
    Other Semi conductor
    Part Number UDV-
    80J
    		 UDV-
    100J
    		 UHP-
    110B
    		 UHP-
    0805MC
    		 UHP-
    1005M3
    		 UHP-
    110M3
    基材 PVC PO
    顏色 T MW
    總厚度 (μm) 80
    		 100
    		 110
    		 85
    		 105
    		 110
    黏著力 (μm) 10 5 10
    Adhesive Strength (N/20mm) 3.8(0.2)
    		 3.8(0.2)
    		 2.9(0.2)
    		 5.0(0.2)
    		 5.0(0.2)
    		 7.6(0.2)
    Probe Tack (N/20mm2) 2.1(0.05)
    		 2.1(0.05)
    		 2.7(0.05)
    		 1.7(0.05)
    		 2.7(0.05)
    		 3.9(0.05)
    特性 Easy pickup For less chipping For small size chips
    Recommended
    Work II     		Package
    Part Number UHP-1025M3
    		 UHP-1510M3
    		 UHP-1525M3
    		 USP-1515M4
    		 USP-1515MG
    基材 PO
    顏色 MW
    總厚度 (μm) 125
    		 160
    		 175
    		 165
    黏著力 (μm) 25
    		 10
    		 25
    		 15
    Adhesive Strength (N/20mm) 12.0(0.2)
    		 6.5(0.2)
    		 13.5(0.2)
    		 14.5(0.2)
    		 15.0(0.2)
    Probe Tack (N/20mm2) 5.5(0.05)
    		 4.2(0.05)
    		 5.6(0.05)
    		 6.2(0.05)
    		 5.9(0.05)
    特性 For encapsulated workpiece
    For less backside burrs
    For less glue scratch-up on the chip side walls
    For less against residue onto a making area
    Recommended
    Work III     		Glass
    Crystal
    Part Number UDT-1025MC
    		 UDT-1325D
    		 UDT-1915MC
    基材 PET
    顏色 T
    總厚度 (μm) 125
    		 155
    		 203
    黏著力 (μm) 25 15
    Adhesive Strength (N/20mm) 30.0(0.2)
    		 20.4(0.2)
    		 20.3(0.2)
    Probe Tack (N/20mm2) 7.5(0.05)
    		 6.7(0.05)
    		 5.9(0.05)
    特性
    • For less backside cracking
    • For encapsulated workpiece
    • For less backside cracking

    ＊( ) is adhesive strength after UV.
    ＊The above data is just for representing value, and not guaranteed value.
    ＊Static type is lined up.
    ＊Color : MW (Milky White), T (Transparent)
    ＊UV irradiate condition : Light volume=above 150mJ/cm2.
    ＊UV irradiate condition may change with dicing products.
    ＊Separator thickness is not included.

    晶圓切割膠帶

    信息內容

    晶圓切割膠帶 - Pressure Sensitive Series -

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.? Elegrip dicing tapes produced by DENKA can correspond with anti-static requirement.? Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

    We Toyo Adtec consider needs of each user and choose appropriate tapes.

    Feature

    ● Various product line
    ● standard type (AD series)
    ● high-performance to difficult-to-adhere workpiece (ＧＤ series)
    ● excellent stability against elapsed deterioration (Ｔ series)
    ● high-performance to laser-dicing (F-90)
    ● Easy pick-up with excellent expandability

    Specification
    Recommended Works Part Number Base
    Film     		Color Thickness (μm) Adhesion Thickness (μm) Adhesive Strength (N/20mm) Probe Tack (N/20mm2) Feature
    Si
    GaAs
    Other Semiconductor     		F-90MW PO MW 90 10 1 1 PVC-free type
    T-80MW PVC 80 0.8 0.7 Excellent temporal stability
    T-80HW 1.7 1
    T-120HW 120 1.7 1
    Thick Workpiece 20GE-200 LB 200 2.7 2.9 For thick workpiece

    ＊The above data is just for representing value, and not guaranteed value.
    ＊Static type is lined up.
    ＊Color : MW (Milky White) ,LB (Light Blue), T (Transparent)
    ＊Separator thickness is not included.

    晶圓切割膠帶 - UV Series -

    A dicing tape is used for fixing workpiece during the dicing process in semiconductor, optical and electrical devices manufacturing.

    High technology is required to a dicing tape with the developments of diversified chips with high quality, in accordance with requirements of each type of workpiece.? Elegrip dicing tapes produced by DENKA are widely used for dicing and singulation of driver ICs, LTCC substrates, EMC package substrates, Si wafers, ceramics, glass, lenses and so on.

    Especially UV series of Elegrip dicing tapes enable strong holding power and easy peeling without glue residue, by deactivating adhesion with UV irradiation.? Elegrip dicing tapes can correspond with anti-static requirement.? Elegrip dicing tapes are supplied to you not only in roll but also in roll with pre-cut, sheet and other form.

    We Toyo Adtec consider needs of each user and choose appropriate tapes.


    Feature

    ● Excellent control to back-side chipping and chip fly-off.
    ● Excellent adhesiveness.
    ● Smooth peeling by UV.
    ● High performance to EMC (Epoxy Mold Compound) and other types of difficult-to-adhere workpiece.

    Recommended
    Work I     		Si
    GaAs
    Other Semi conductor
    Part Number

    UDV-
    80J

    UDV-
    100J

    UHP-
    110B

    UHP-
    0805MC

    UHP-
    1005M3

    UHP-
    110M3

    基材 PVC PO
    顏色 T MW
    總厚度 (μm)

    80

    100

    110

    85

    105

    110

    黏著力 (μm) 10 5 10
    Adhesive Strength (N/20mm)

    3.8(0.2)

    3.8(0.2)

    2.9(0.2)

    5.0(0.2)

    5.0(0.2)

    7.6(0.2)

    Probe Tack (N/20mm2)

    2.1(0.05)

    2.1(0.05)

    2.7(0.05)

    1.7(0.05)

    2.7(0.05)

    3.9(0.05)

    特性 Easy pickup For less chipping For small size chips
    Recommended
    Work II     		Package
    Part Number

    UHP-1025M3

    UHP-1510M3

    UHP-1525M3

    USP-1515M4

    USP-1515MG

    基材 PO
    顏色 MW
    總厚度 (μm)

    125

    160

    175

    165

    黏著力 (μm)

    25

    10

    25

    		15
    Adhesive Strength (N/20mm)

    12.0(0.2)

    6.5(0.2)

    13.5(0.2)

    14.5(0.2)

    15.0(0.2)

    Probe Tack (N/20mm2)

    5.5(0.05)

    4.2(0.05)

    5.6(0.05)

    6.2(0.05)

    5.9(0.05)

    特性 For encapsulated workpiece
    For less backside burrs
    For less glue scratch-up on the chip side walls
    For less against residue onto a making area
    Recommended
    Work III     		Glass
    Crystal
    Part Number

    UDT-1025MC

    UDT-1325D

    UDT-1915MC

    基材 PET
    顏色 T
    總厚度 (μm)

    125

    155

    203

    黏著力 (μm) 25 15
    Adhesive Strength (N/20mm)

    30.0(0.2)

    20.4(0.2)

    20.3(0.2)

    Probe Tack (N/20mm2)

    7.5(0.05)

    6.7(0.05)

    5.9(0.05)

    特性
    • For less backside cracking
    • For encapsulated workpiece
    • For less backside cracking

    ＊( ) is adhesive strength after UV.
    ＊The above data is just for representing value, and not guaranteed value.
    ＊Static type is lined up.
    ＊Color : MW (Milky White), T (Transparent)
    ＊UV irradiate condition : Light volume=above 150mJ/cm2.
    ＊UV irradiate condition may change with dicing products.
    ＊Separator thickness is not included.
    [←]晶圓

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